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Stellantis & Foxconn Sign Non-Binding Agreement To Build Semiconductor Chips!

Stellantis & Foxconn Sign Non-Binding Agreement To Build Semiconductor Chips!​

Purpose-Built Semiconductors Will Support Stellantis & Third-Party Customers...​


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Stellantis and Hon Hai Technology Group, (“Foxconn”) have announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.

moparinsiders.com

Stellantis & Foxconn Sign Non-Binding Agreement To Build Semiconductor Chips!

Stellantis and Hon Hai Technology Group, (“Foxconn”) have announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.
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That Chrysler interior they keep teasing looks very promising
 
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