Stellantis & Foxconn Sign Non-Binding Agreement To Build Semiconductor Chips!
Purpose-Built Semiconductors Will Support Stellantis & Third-Party Customers...
Stellantis and Hon Hai Technology Group, (“Foxconn”) have announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.
Stellantis & Foxconn Sign Non-Binding Agreement To Build Semiconductor Chips!
Stellantis and Hon Hai Technology Group, (“Foxconn”) have announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.
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